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HDG104

HDG104

802.11b/g Wi-Fi complete System in Package (SiP) component in 44-pin QFN , support SDIO/SPI. Certified , FCC, CE. Size: 7x8mm

The HDG104 is a complete Wireless LAN System inPackage (SiP) with ultra low power consumption and high supply voltage handling, optimized for embedded devices such as wireless sensors for industrial and home control , AMR for smart and green energy control, remote device management such as location tracking and the growing segment of equipment and consumer electronic devices such as Portable Media devices, IP-radio, home security, wireless speakers and IP audio devices.

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The HDG104 SiP format, with its complete system functionality, means quicker design cycles, lower risk and simplified manufacturing, all in a very small package (7,1× 7,7 mm). Lack of external components simplifies assembly test and reduces yield loss. The HDG104 SiP delivers a complete and fully tested and trimmed implementation of 802.11b/g functionality. The HDG104 is fully FCC and CE compliant, and is internally tested to meet FCC/CE and a FCC/CE approval.

The HDG104 solution is Pre- tested, calibrated and certified resulting in lowest possible production and system cost.

Data Sheet

 

Key Features

  • Smallest Wi-Fi component in the market: 56mm2
  • Lowest power consumption solution in the market for embedded applications.
  • High RF output TX power (+17dBm) and RX sensitivity
  • Supports multiple SW features incl 802.11e/i (Security, Quality of Service)
  • External discrets needed: 19 + antenna
  • External chips:40MHz (or from system)
  • Pre-calibrated and programmed with MAC adr.
  • No RF trimming needed
  • 32KHz from host CPU

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H&D Wireless AB
Färögatan 33, Kista Science Tower
164 51 Kista, Sweden
E-mail: This email address is being protected from spambots. You need JavaScript enabled to view it.
E-mail: This email address is being protected from spambots. You need JavaScript enabled to view it.
Office: +46-8-55118460

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