Wi-Fi a/b/g/n, BT Classic/LE SiPs, 8x8mm
- 2,4GHz+5GHz
- 802.11 abgn+BT Classic and LE
- Linux OS
- FCC,IC,CE
- Product briefs contact: This email address is being protected from spambots. You need JavaScript enabled to view it.
- 802.11 bgn
- Embedded OS
- Multimedia
- Pre FCC,IC,CE
- 802.11 bgn
- Linux OS
- Pre FCC,IC,CE
- 802.11 bgn
- Full TCP/IP stack
- Pico API + SDK
- Tiny driver
- Pre FCC, CE
Products
HDG104
802.11b/g Wi-Fi complete System in Package (SiP) component in 44-pin QFN , support SDIO/SPI. Certified , FCC, CE. Size: 7x8mm
The HDG104 is a complete Wireless LAN System inPackage (SiP) with ultra low power consumption and high supply voltage handling, optimized for embedded devices such as wireless sensors for industrial and home control , AMR for smart and green energy control, remote device management such as location tracking and the growing segment of equipment and consumer electronic devices such as Portable Media devices, IP-radio, home security, wireless speakers and IP audio devices.
HDG820P
Wi-Fi SiP 802.11 b/g/n + on board tcp/ip stack
API Pico mode, 8x8mm, Pre FCC/CE/IC
The SPB820P/HDG820PP/HDG820P solution is a complete WiFi module with state of the art embedded security protocols and low power features.
HDG205
Wi-Fi SiP 802.11 b/g/n component in 44-pin QFN
For embedded, STM32 cortex, 8x8mm, Pre FCC/CE/IC
HDG205 is a complete WLAN System In Package, SIP, solution specifically designed to address the proliferation of Wi-Fi technology into embedded devices.
HDG200
Wi-Fi SiP 802.11 b/g/n component in 44-pin QFN.
For Linux systems, 8x8mm, Pre FCC/CE/IC
The HDG200 is a complete Wireless LAN System inPackage (SiP) with ultra low power consumption, optimized for embedded devices. The HDG200 Wi-Fi solution is supported on leading Microcontroller platform and is optimal for developers that want to build wireless internet connected devices for the Smart Home, Clean Tech, Multimedia and Industry automation market! The HDG200 delivers a data transfer speed up to 72Mbps.
